Electronics

Hotmelt casting compounds

1-component co-polyamides are casting compounds, which are thermoplastic materials for the low pressure casting in electronic and electrical applications. These hot melt materials are unreactive. The application occurs in fixed forms comparable with plastic injection moulding. The co-polyamides have a very low viscosity and therefore need a low injection pressure in the injection mould, which is why the handling with low pressure gas dosing systems is adequate. These hot melt substances are used when very short cycle times are required.


Low pressure casting technology is the ideal procedure for

  • sealing and gluing sandwich components
  • against moisture and mechanical damage
  • forming also for non-standard component contours
  • relief of, i.e., cable inlets for pressure and / or drag, insulating against collisions, vibrations and shock
  • insulation against heat, cold and electric energy
  • fixating of different components and materials among each other

High-quality, thermoplastic PA-hot melt adhesives with elastomer properties are used as substances. 


The areas of application include

  • Plate casting
  • Conductor foil casting
  • Cable and hose covers
  • Electrical plugs and sockets
  • Sensors and switches, also miniature switches
  • Transmitters and receivers from high-frequency technology
  • Amplifiers and spooling
  • Single conductor and bundle sealing

We offer:

  • Hot melt UL 94 V0 permitted:
    Euremelt 3413
    Euremelt 2170
  • Hot melt without UL 94 Vo:
    Euremelt 2110
    Euremelt 2115